Semiconductor Bonders

Orthodyne Semiconductor Wedge and PowerRibbon^® Bonders are the fastest and most productive bonders in the industry, featuring state-of-the-art motion control technology, intuitive software, and real-time process monitoring for power leadframe applications, such as TO-220, TO-247, DPAK, multi-lead SOP, QFN and DSO packages.

Exceptional process monitoring capability is provided, with one to four in-line non-destructive pulltesters per bondhead. To further enhance quality assurance, the optional Bond Process Monitoring (BPM) system is available. The Orthodyne GS3 Pattern Recognition system is the most versatile PR system available for power devices.

Orthodyne's focus on the rapidly-evolving power semiconductor industryallows us to engineer new equipment and processes that meet our customers' requirements for high productivity, process stability, low cost of ownership (COO) and flexibility to adapt to market demands.

7200PLUS

7200HD

7600HD