High-Density Dual-head Wedge Bonder 7200HD

Specifications

Transport Station
Pull-out for easy setup and product changeover, Vertical moving anvil
Clamp Station
Integrated into pull-out Transport Module
Clamp Height
Programmable for speed optimization
Clamp Force
1.5x greater than 7200Plus
Indexer
Custom Multi-Pitch Programming for strips with multiple pitches
Indexer repeatability
±15μm (2x improvement) Linear encoder
Index and Clamp time
150 ms for typical TO-220 device
Strip Dimensions
110 - 260 mm length 18 - 72 mm width 3 mm maximum down-set
Magazine Size
20 - 80 mm width 50 - 170 mm height 117 - 265 mm length
Magazine Pitch
Programmable, 3 mm minimum
Transport Pulltesters
1 - 4 pulltesters per bonder module for 100 - 500μm wire Pull force: 20 - 500g non-destructive