Automatic Dual-head Wedge Bonder 7200PLUS
Specifications |
|
General |
|
| Bond Area | 70mm x 70mm |
| Z - Axis | 50mm Z-stroke |
| 0- Axis | ± 220° |
Large Wire Bond Head |
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| Type | Orthodyne Rotary, Front cut or back cut versions, optional with active clamps (ALC) |
| Transducer | Orthodyne, optional 80 kHz, 60 kHz, other frequencies upon request |
| Bond Force | Programmable 50g - 1500g |
| Bondhead Pull Test | Available for ALC style bond head. Large wire only |
Small Wire Bond Head |
|
| Type | Orthodyne Rotary, low mass, deep access |
| Tear & Feed | Clamp tear, programmable, pinch force |
| Bond Force | 10 - 200g |
| Transducer | Orthodyne miniature, 120 kHz |
| Wire Feed Angle |
45° or 60° |
Power Ribbon® Bond Head |
|
| Type | Orthodyne Rotary |
| Transducer | Orthodyne |
| Ribbon Tile | 20 x 4 mil to 80 x 8 mil, others may be available upon request |
Wire Handling Large Wire |
|
| Wire Range | 100 μm to 500 μm, diameter, <125 μm front cut recommended |
| Wire Feed | Motorized wire dereeler with optical encoder |
| Missing Wire Detection | Wire deformation monitoring |
Wire Handling Small Wire |
|
| Wire Range | 25μm to 75 μm diameter |
| Wire Feed | Motorized wire dereeler with optical encoder |
| Missing wire Detection | Wire deformation monitoring |
Leadframe Handler |
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| Clamp Station | Removable vertical moving anvil, horizontal moving anvil, matrix |
| Strip Dimensions | 160 - 260 mm length 18 - 72 mm width Note: Short non-matrix strips, 110 - 159 mm long, may require a kit, Max 3 mm down-set |
| Indexer | Programmable pitch, 3.3 μm resolution, 40 mm maximum travel when matrix module is used, 60 mm for other modules |
| Index time | 150 ms for typical TO 220 device (includes clamping) |
| Magazine Size | 20 - 80 mm width 50 - 170 mm height 115 - 265 mm length |
| Magazine Pitch | Programmable, 3 mm minimum |
| Transport Pulltester | Up to 4 non-destructive pulltesters per bonder module (up to a total of 8 per system) |