Small Wire Wedge Bonder 3700PLUS

Specifications

Bond Area 150mm (Y) x 250 mm (X)
Optional 300mm x 300mm worktable
Z-Axis 50mm Z-stroke, 0.5μm resolution, 0.1μm overtravel resolution
0-Axis ±220°, 0.0035° resolution

Small Wire Bondhead
Type Orthodyne Rotary, low mass, deep access optional 45° or 60° wire feed angle head available
Tear & Feed Clamp tear, programmable, 10µm resolution, programmable pinch force
Bond Force 10 - 200 g, 1 g resolution
Transducer Orthodyne miniature, 120 kHz
Wire Range 25µm to 75µm diameter