Landal Seal®

With their new lead-free solder Landal-Seal®, Pfarr Stanztechnik pushed back the barriers of what was achievable. With a melting point of 214° C, this vacuum-quality solder offers a wide range of possibilities for metal joining processes. The patented chemical composition confers extraordinary metallurgical and mechanical properties on this solder. For instance, the stability to temperature cycling between -40° C and 150°C is about three times as high as for conventional SnAgCu solders.

Resistance to creepage and dealloying is much better than for SAC solders, while wetting properties are also greater. Results of dealloying tests Using a 2 mm copper wire starting diameter, after dipping into a pot of molten solder and 100 h at 250°C in a circulating furnace. Resistance to creepage at 180°C in comparison to SAC