Orthodyne Electronics

See why Orthodyne Electronics Bonders are the market leaders:

#1 in Power Semiconductor Wedge Bonders

#1 in Power Module and Hybrid Wedge Bonders

#1 in PowerRibbon^® Bonders

Combining innovation with over 40 years of experience in Power Interconnect Technology, Orthodyne Electronics’ Automatic Wedge Bonders are the industry’s fastest, most productive and most cost-effective wedge bonders for power applications.

Serving the power semiconductor and MCM/hybrid assembly markets, Orthodyne can support your company's roadmap for complex packages while offering higher productivity and yields at the lowest possible cost. All of our equipment is backed by Orthodyne’s experienced engineering, applications and field service staff who are ready to help you with your most challenging processes.

Orthodyne bonders have a connection to your daily life.  Interconnects made with Orthodyne bonders are in automobiles, aircraft, satellites, military electronics, appliances, communication devices, hand-held devices, computers, mobile phones and televisions.  Anything with a controlled power source is likely to contain Orthodyne bonds.