Pfarr soft solders are produced from specially alloyed elements of extremly high-purity (min. 99,99%). They are prepared in a deoxidising melt or under vacuum, respectively. The materials are oxide-free with excellent flow and wetting characteristics.

Soft solders are available as:

• fine blankings, ribbons, narrow foils, wire and wire slugs, spheres, ingots

Typical Applications:

• assembly of semiconductor packages such as bridges and module

• soldering the semiconductor crystals in discrete component

• microelectronic component assembly