Thanks to our special manufacturing technique the balls offer a superb level of quality. Our patented soft solder, Landal-Seal®, is particularly suitable for BGA applications. The surface remains clear of dendrites and is clean, smooth and free from scratches. It therefore offers decisive benefits compared to alternative lead-free solders. Excellent mechanical properties are a further feature of Landal-Seal®. We also supply solder balls in other alloys such as leadbased and tin-based compositions.

BGA spheres are available in diameters from 0,2 mm, with diameter and form tolerances of +/- 10 µm and Cpk of >1,33. Further details are available on request.

Typical applications:

• BGA Packages are used in telecommunications and microprocessors