Materials:

• cold-rolled steel, thickness e. g. 0.15 mm

• special plastics, thickness e. g. 0.35 mm

Dimensions:

The masking squares are available in widths from 0.6 mm and the discs in diameters from 0,6 mm.

Typical applications:

The squares or discs, bound by a special process to silicon wafers, serve to mask the chips from damage as they are individually cut out by sand blasting.